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DataSheet.in
ECMF04-4AMX12
Common mode filter with ESD protection for MIPI D-PHY and MDDI interface
Features

Very large differential bandwidth > 6 GHz High common mode attenuation: - -34 dB at 900 MHz - -20 dB between 800 MHz and 2.2 GHz Very low PCB space consumption Thin package: 0.6 mm max Lead-free package High reduction of parasitic elements through integration

Micro QFN-12L 3.3 mm x 1.5 mm
Applications

Mobile phones Notebook, laptop Portable devices PND
Figure 1.
Pin configuration and schematics
D1+
ESD ESD
D1+
Description
The ECMF04-4AMX12 is a highly integrated common mode filter designed to suppress EMI/RFI common mode noise on high speed differential serial buses like MIPI D-PHY or MDDI. The ECMF04-4AMX12 can protect and filter 2 differential lines.
D1ESD ESD
D1-
GND1
NC
NC
GND0
D0+
ESD ESD
D0+
D0ESD ESD
D0-
August 2010
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DataSheet.in
Characteristics
ECMF04-4AMX12
1
Table 1.
Symbol VPP IDC Top Tj Tstg
Characteristics
Absolute maximum ratings (Tamb = 25 C)
Parameter ESD discharge IEC 61000-4-2, contact discharge Maximum DC current Operating Temperature Maximum junction temperature Storage temperature range Value 8 100 -40 to +85 125 - 55 to +150 Unit kV mA C C C
Figure 2.
Electrical characteristics (definitions)
Table 2.
Symbol VBR IRM RDC
Electrical characteristics (values, Tamb = 25 C)
Test conditions IR = 1 mA VRM = 1.5 V per line DC serial resistance 1.8 Min. 6 100 2.5 Typ. Max. Unit V nA
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ECMF04-4AMX12
Characteristics
Figure 3.
0 - 0.2 - 0.4 - 0.6 - 0.8 -1 - 1.2 - 1.4 - 1.6 - 1.8 -2 - 2.2 - 2.4 - 2.6 - 2.8 -3 300k
Sdd21 differential attenuation measurements (Z0 diff = 100 )
Figure 4.
0 -2 -4 -6 -8 - 10 - 12 - 14 - 16 - 18 - 20 - 22 - 24 - 26 - 28 - 30 - 32 - 34 - 36 300k
Scc21 common mode attenuation measurements (Z0 com = 50 )
F(Hz)
1M 3M 10M 30M 100M 300M 1G 3G
F(Hz)
1M 3M 10M 30M 100M 300M 1G 3G
Figure 5.
Sdd11, Sdd22 differential return loss Figure 6. measurements (Z0 diff = 100 )
0
Sdd41 / Sdd23 inter-lane differential cross-coupling measurements (Z0 diff = 100 )
0 Sdd11 -5 - 10 - 15 - 20 - 25 - 30 - 35 - 40 300k 1M 3M 10M 30M 100M 300M 1G Sdd22
- 10 - 20 - 30 - 40 - 50 - 60 - 70 - 80 - 90 - 100
F(Hz)
3G
- 110 300k
F(Hz)
1M 3M 10M 30M 100M 300M 1G 3G
Figure 7.
Scc41 / Scc23 inter-lane common-mode cross-coupling measurements (Z0 com = 50 )
0 - 10 - 20 - 30 - 40 - 50 - 60 - 70 - 80 - 90 - 100 300k 1M 3M 10M 30M 100M 300M 1G
F(Hz)
3G
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Characteristics Figure 8. ESD measurement test setup
ECMF04-4AMX12
2*20dB attenuator ESD contact zap 8kV on pin 1
D1+
ESD ESD
D1+
D1ESD ESD
D1-
Oscilloscope, 50 input
GND1
NC
2*20dB attenuator
NC GND0 D0+
ESD ESD
D0+
D0ESD ESD
D0-
Figure 9.
ESD response to IEC 61000-4-2 (+8kV contact discharge) - see Figure 8 for test setup
20 ns/Div
Figure 10. ESD response to IEC 61000-4-2 (-8kV contact discharge) - see Figure 8 for test setup
20 ns/Div
PIN 12
20 V/Div
Vpeak = 82 V C2 PIN 12
20 V/Div
C2 Vpeak = -70 V PIN 11
Vpeak = 110 V C3
PIN 11
C3 Vpeak = -115 V
50 V/Div
20 ns/Div
50 V/Div
20 ns/Div
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ECMF04-4AMX12 Figure 11. MIPI D-PHY low power mode test setup
Characteristics
Generator Agilent 81110 Pattern mode, F=10MHz, modulation RZ, 50 output
Oscilloscope Lecroy 7300A, 1M input
CMF
Figure 12. Low power pulse response - see Figure 11 for test setup
500 mV/div Pulse: 50 ns, tr = tf = 5 ns
200 ns/div 500 mV/div
200 ns/div
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Application information
ECMF04-4AMX12
2
Application information
Figure 13. Application information
Camera
CSI Transmitter Data N+ Data N GND
D1+ D1GND1 NC
D+ D+
ECMF02-2AMX6
Application Baseband
CSI Receiver Data N+ Data N GND
D-
D-
GND
NC
Data 1+ Data 1GND
D1+ D1NC GND0 D0+ D0-
Data 1+ Data 1GND
Clock + Clock GND
D0+ D0-
Clock + Clock GND
ECMF04-4AMX12
CCI Slave
SCL SDA
IN 1 4 OUT
CCI Master
SCL SDA
GND 2 3 5 GND 6
IN
OUT
EMIF02-1003M6
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ECMF04-4AMX12
Ordering information scheme
3
Ordering information scheme
Figure 14. Ordering information scheme
ECMF Function Common mode filter with ESD protection yy x z MX12
Number of filtered lines yy = Number of filtered lines
Number of ESD protected lines
4 = 4 lines with ESD protection
Version Z = Version Package MX = micro QFN, pitch 500 m, 12 = 12 pads
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Package information
ECMF04-4AMX12
4
Package information

Epoxy meets UL94, V0 Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Table 3. Micro QFN-12L 3.3 x 1.5 dimensions
Dimensions
D
Ref.
E
Millimeters Min. Typ. 0.55 0.02 0.25 3.3 1.5 0.5 0.4 Max. 0.6 Min.
Inches Typ. Max.
A
TOP VIEW
0.51 0 0.18 3.25 1.45 0.45 0.3
0.020 0.022 0.024
A1
A A1
SIDE VIEW
0.05 0.000 0.001 0.002 0.3 0.007 0.010 0.012
b D
e
3.35 0.128 0.130 0.132 1.55 0.057 0.059 0.061 0.55 0.018 0.020 0.022 0.5 0.012 0.016 0.020
b
E e
L
L
Figure 15. Footprint (dimensions in mm) Figure 16. Marking
KC
Note:
Product marking may be rotated by 90 for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose.
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ECMF04-4AMX12 Figure 17. Micro QFN-12L 3.3 x 1.5 tape and reel specification
Dot identifying Pin A1 location
Package information
O 1.55 0.05 2.0 0.05 4.0 0.1 1.75 0.1 5.5 - 0.1
12.00 0.3
KC
KC
KC
3.70 0.10
1.70 0.10
4.0 0.1
0.80 0.10
All dimensions in mm
User direction of unreeling
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Recommendation on PCB assembly
ECMF04-4AMX12
5
5.1
Recommendation on PCB assembly
Stencil opening design
1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).
Figure 18. Stencil opening dimensions
L
T
W
b)
General design rule Stencil thickness (T) = 75 ~ 125 m W Aspect ratio = ---- 1.5 T LxW Aspect area = --------------------------- 0.66 2T ( L + W )
2.
Reference design a) b) Stencil opening thickness: 100 m Stencil opening for leads: Opening to footprint ratio is 90%.
Figure 19. Recommended stencil window position
15 m
570 m
7 m 236 m 250m
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Stencil window Footprint
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600 m
DataSheet.in
ECMF04-4AMX12
Recommendation on PCB assembly
5.2
Solder paste
1. 2. 3. 4. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004. "No clean" solder paste recommended. Offers a high tack force to resist component displacement during PCB movement. Use solder paste with fine particles: powder particle size 20-45 m.
5.3
Placement
1. 2. 3. 4. Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering. Standard tolerance of 0.05 mm is recommended. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools.
5. 6.
5.4
PCB design preference
1. 2. To control the solder paste amount, the closed via is recommended instead of open vias. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away.
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Recommendation on PCB assembly
ECMF04-4AMX12
5.5
Reflow profile
Figure 20. ST ECOPACK(R) recommended soldering reflow profile for PCB mounting
Temperature (C)
260C max 255C 220C 180C 125 C
2C/s recommended 2C/s recommended 6C/s max 6C/s max
3C/s max 3C/s max
0 0 1 2 3 4 5
10-30 sec 90 to 150 sec 90 sec max
6
7
Time (min)
Note:
Minimize air convection currents in the reflow oven to avoid component movement.
5.6
Layout recommendation
Connection to PCB GND must be as short as possible to ensure ESD remaining voltage and SCC21 performance. Figure 21. Layout recommendation
Zdiff according to the application
Vias to GND plane
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ECMF04-4AMX12
Ordering information
6
Ordering information
Table 4. Ordering information
Marking KC(1) Package Micro QFN Weight 7.25 mg Base qty 3000 Delivery mode Tape and reel 7"
Order code ECMF04-4AMX12
1. The marking can be rotated by 90 to differentiate assembly location
For the latest information on available order codes see the product pages on www.st.com.
7
Revision history
Table 5.
Date 10-Aug-2010
Document revision history
Revision 1 Initial release. Changes
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ECMF04-4AMX12
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